OIF, where the optical networking industry’s interoperability work gets done, today announced its live, multi-vendor interoperability demonstration for the ECOC 2026 Exhibition being held September 21 – 23 in Malaga, Spain.
Featuring 39 participating member companies in booth 2126, the demonstration showcases how open interoperability is helping the industry transition next-generation optical networking technologies, from specification to real-world deployment for AI infrastructure.
OIF’s demonstration will highlight interoperability across Optical Systems, 448G and 224G Common Electrical I/O (CEI), Common Management Interface Specification (CMIS), Co-Packaging, Energy Efficient Interfaces (EEI) and other interoperability initiatives.
The pace of AI infrastructure deployment is placing greater emphasis on proven interoperability across the networking ecosystem. OIF’s live demonstration showcases how its Implementation Agreements (IAs) enable interoperable solutions that simplify integration, preserve vendor choice and accelerate the deployment of next-generation optical networks.
“The value of a specification is ultimately measured by how well products from multiple companies work together,” said Mike Klempa, OIF Secretary/Treasurer and Physical and Link Layer (PLL) Interoperability Working Group Chair (Qualcomm). “At ECOC, OIF members will demonstrate interoperability in action, validating technologies across the ecosystem to reduce integration risk, accelerate adoption and support the open, scalable networks required for the next generation of AI infrastructure.”
By bringing together component suppliers, system vendors, cloud providers, network operators and test equipment companies, the demonstration validates interoperable implementations before commercial deployment, reducing integration risk and accelerating market adoption.
Participating companies include 1Finity, Adtran, Amphenol Communications Solutions, AOI, Arycs Technologies, Astera Labs, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., ColorChip, Corning Incorporated, EXFO, Fast Photonics, Furukawa Electric, Genuine Optics, H3C, HPE, Keysight Technologies, Ligent, Inc., Lightmatter, Marvell, Molex, MultiLane, MultiLane Test Products, Nokia, O-Net, Qualcomm, Samtec, Silith, Sumitomo Electric Industries, TE Connectivity, TeraHop PTE Limited, TeraSignal, US Conec, VeEX Inc., Wilder Technologies and Xscape Photonics.
Additional information about OIF’s participation at ECOC 2026 is available at https://www.oiforum.com/meetings-events/oif-ecoc-2026/.
About OIF
OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 170+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X, on Bluesky and at https://www.oiforum.com/.
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